A new innovation in memory technology could transform the design of AI-powered wearable devices. Longsys, a global leader in storage solutions, has introduced a subsize eMMC memory chip measuring just 7.2mm × 7.2mm – one of the smallest of its kind on the market.
The ultra-compact memory chip is designed to meet the increasing demands of wearable devices, where space efficiency is crucial. Compared to the industry-standard eMMC size of 11.5mm × 13mm, Longsys’ new solution offers a 65% reduction in surface area, weighing just 0.1g – approximately 67% lighter than conventional counterparts.
This significant size reduction allows manufacturers to incorporate additional components or functionalities into wearable designs without increasing device dimensions. Wearable devices such as smartwatches, glasses, and earbuds could benefit from this innovation, maintaining their sleek and lightweight profiles while improving performance.
Despite its small size, the eMMC chip delivers on capacity and efficiency. With storage options of 64GB and 128GB, it meets the needs of AI wearables for fast processing, efficient data handling, and seamless application performance. The chip’s in-house firmware also supports advanced features such as intelligent sleep modes and dynamic frequency scaling, reducing energy consumption and extending battery life.
The chip is packaged and tested at Longsys’ Suzhou Packaging & Testing Base, a facility specialising in NAND Flash and DRAM technologies. Longsys’ proprietary grinding and cutting processes enable the creation of this ultra-compact chip while ensuring high standards of compatibility, reliability, and thermal management.
The company has been at the forefront of eMMC advancements, having introduced its own eMMC controllers and QLC (quad-level cell) eMMC in 2024. Longsys’ comprehensive full-stack customisation capabilities extend beyond design to include product development and manufacturing, allowing them to cater to diverse client needs across industries.
The move towards compactness aligns with the increasing demand for smarter, more efficient wearable devices. Industry experts suggest that innovations like Longsys’ subsize eMMC could drive advancements in AI wearables, enabling new use cases and improved user experiences.
Longsys CEO Linan Xie said the company remains committed to driving memory technology innovation: “This ultra-compact eMMC represents a significant milestone in our product line, supporting the next generation of wearable devices with enhanced capabilities in an increasingly compact design.”
As the wearable technology market grows, with applications expanding from fitness and health monitoring to augmented reality, the demand for compact and high-performing components is expected to rise. Longsys’ latest development marks a step forward in overcoming the space constraints that challenge wearable device manufacturers.
By integrating cutting-edge packaging technologies and delivering efficient solutions, Longsys aims to maintain its leadership in memory innovation, bringing new possibilities to the future of AI wearables.
